All Entries in the Tag : IP

Electrolyte Synthesis For Ultracapacitors

A method of forming an electrolyte solution involves combining ammonium tetrafluoroborate and a quaternary ammonium halide in a liquid solvent to form a quaternary ammonium tetrafluoroborate and an ammonium halide.

: R&D | ,

Nanobiomimetic Supercaps With High Rate High Energy Storage

Nanobiomimetic supercapacitors comprise an “Electron Well” and an “Electron-Dam” Membrane Electrode Assembling (MEA); the “Electron-Well” MEA compromises an electrode comprising a substrate of glassy carbon; a self-assembling membrane comprises a polymer matrix.

: R&D | ,

Ceramic Powder, Semiconductor Capacitor and Method of Manufacturing

A ceramic powder for use in a grain boundary insulated semiconductor ceramic that has an excellent ESD withstanding voltage, a semiconductor ceramic capacitor using the ceramic powder, and a manufacturing method therefor.

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Solid Electrolytic Capacitor And Method For Producing

A solid electrolytic capacitor element having a solid electrolyte layer provided on a dielectric layer formed on a surface of an anode body comprising a valve acting metal including a pore, wherein the anode body is configured in such a way that multiple plate-shaped anode bodies are directly piled and integrated with a solid electrolyte, and adjacent piled anode bodies are joined at a section thereof, and a method for producing the solid electrolytic capacitor element.

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Issues in embedding components in PCB substrates

Continued pressure for electronic devices that provide greater functionality in ever-smaller form-factors is not only providing the driving force behind developing smaller surface-mount components and semiconductor geometries, but is also fueling another trend that sees passive and active components being embedded within PCB substrates.

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Development of World’s Smallest High Performance Capacitor

A group of researchers led by Dr. Takayoshi Sasaki and Dr. Minoru Osada of MANA of NIMS, succeeded in developing the world’s smallest high-performance capacitor by assembling two types of oxide nanosheets, – a conductive oxide nanosheet and a dielectric oxide nanosheet – into a sandwich structure, in the manner of LEGO block game.

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Direct Current DC Link Capacitor Module

A direct current (DC) link capacitor module includes a printed circuit board (PCB) formed by sequentially disposing a first electrode substrate, an insulation substrate, a second electrode substrate, a third electrode substrate.

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